AI infrastructure is demanding an unpresidented increase in network density. Scale-up and scale-out fabrics need radix which is bottlenecked by how much you can physically fit on a switch’s front panel and conventional cooling technologies.

XPO rises to the challenge by providing unmatched faceplate bandwidth density, paired with the liquid cooling required to run an extreme power-dense system at scale. 

As the MSA moves toward 2027 production timelines, the mechanical and thermal architecture decisions product teams make now will shape their designs for years to come.

Getting that architecture right requires partners who understand the spec from the inside — not vendors reverse-engineering it after the fact.